Interlink-electronics Ring Sensor Instrukcja Użytkownika Pobierz pdf (Strona 6)

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Ring Sensor

Integration Guide

STIFFENER SUBSTRATE

FSR SUBSTRATE

STIFFENER ADHESIVEREAR ADHESIVE

GRAPHIC ADHESIVE

8.0 STIFFENER

GRAPHIC

42.7

USER

ACTIVE AREA

43.0

13.3

5.0

4.0 Mounting and Connection

4.1 Mounting

There are a few critical elements to consider when mounting the Ring Sensor:

 The mounting surface should be free of any raised features (e.g. copper traces on a PCB

or dust contamination) as they will interfere with the sensor’s proper operation.

 If the sensor is being mounted to a PCB, it should be installed after PCB assembly is

complete. Heat generated during the soldering of components can damage the Ring

Sensor.

 When laminating the sensor, be sure to use a hard roller or other depression tool to ensure

proper bonding of the sensor’s pressure-sensitive adhesive and the removal of any air

bubbles.

Figure 3: Overall dimensions of the Ring Sensor. All dimensions are in millimeters.

1 2 3 4 5 6 7 8 9 10 11 12 13 14

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Interlink-electronics Ring Sensor Instrukcja Użytkownika Strona 6